BDN09-3CB/A01 - CTS Thermal Management Products

Mfr. #:
BDN09-3CB/A01
Description:
Heat Sink Passive Pin Array Adhesive 26.9C/W Black Anodized
Lifecycle:
New from this manufacturer.
Delivery
DHL / FedEx / Ups / TNT / EMS
Payment
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Specifications

Type Top Mount
Attachment-Method Thermal Tape, Adhesive (Included)
Product Category Thermal - Heat Sinks
Shape Square, Pin Fins
Manufacturer CTS Thermal Management Products
Material-Finish Black Anodized
Series BDN
Package-Cooled Assorted (BGA, LGA, CPU, ASIC...)
Material Aluminum
Thermal-Resistance-Forced-Air-Flow 9.6°C/W @ 400 LFM
Thermal-Resistance-Natural 26.9°C/W
Length 0.910" (23.11mm)
Width 0.910" (23.11mm)
Height-Off-Base-Height-of-Fin 0.355" (9.02mm)
Diameter -
Power-Dissipation-Temperature-Rise -

More Information

parts# BDN09-3CB/A01 is available at OMO Electronic, see description of BDN09-3CB/A01 as below .
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BDN09-3CB/A01 Price & Stock

IERC BDN09-3CB/A01 pricing and available inventory.

SellerSKUStock 1 10 100 1000 10000 Updated
Freelance ElectronicsBDN09-3CB/A014028.0422.3117.4217.4217.422020-04-24T16:21:47Z

Alternate Names

IERC has several brands around the world that may have alternate names for BDN09-3CB/A01 due to regional differences or acquisition. BDN09-3CB/A01 may also be known as the following names: